MIT researchers produce 3-D configurations that could lead to new microchips and other devices.
MASSACHUSETTS–(ENEWSPF)–June 8, 2012. Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.
Although similar self-assembling structures with very fine wires have been produced before, this is…
